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XCVC1702-1MLINSVG1369

  • image of System On Chip (SoC)>XCVC1702-1MLINSVG1369
  • image of System On Chip (SoC)>XCVC1702-1MLINSVG1369
XCVC1702-1MLINSVG1369
System On Chip (SoC)
Xilinx (AMD)
IC VERSAL AI-CO
Tray
0
: $25,513.8625
: 0

1

$25,513.8625

$25,513.8625

image of System On Chip (SoC)>XCVC1702-1MLINSVG1369
XCVC1702-1MLINSVG1369
XCVC1702-1MLINSVG1369
System On Chip (SoC)
Xilinx (AMD)
IC VERSAL AI-CO
Tray
0
Product parameter
PDF(1)
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ AI Core
PackageTray
Product StatusACTIVE
Package / Case1369-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O500
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-FCBGA (35x35)
ArchitectureMPU, FPGA
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